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this document is provided "as is" with no warranties what soever, including any warranty of merchantability, non-in- fringement, fitness for any particular purpose, or any warrant y otherwise arising out of any proposal, specification, or sample. omnivision technologies, inc. disclaims all liability, including liability for infringement of any proprietary rights, relating to the use of information in this do cument. no license, express ed or implied, by estoppel or otherwise, to any intellectual property rights is granted herein. * third-party brands, names, and trademarks are the property of their respective owners. note: the information contained in this document is consider ed proprietary to omnivision technologies, inc. this information may be distributed only to individuals or organi zations authorized by omnivision technologies, inc. to receive said information. individuals and/or organizati ons are not allowed to re-distribute said information t echnical b ulletin o mni tm ision omnivision packaging specifications last modified: 3 february 2003 document version: 1.2 revision number date revision 1.0 04/02/02 release to marketing 1.1 10/09/02 minor corrections 1.2 02/03/03 add backend chip package specifications and minor corrections
2 proprietary to omni vision technologies version 1.2, february 3, 2003 omnivision packaging specifications o mni ision 00 table of contents section 1, general description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 section 2, die position . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 die shift specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 die tilt specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.3 die rotation specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 section 3, camerachip package specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.1 24-pin clcc ceramic package specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.2 28-pin clcc ceramic package specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.3 28-pin plcc plastic package specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.4 48-pin clcc ceramic package specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.5 48-pin plcc plastic package specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 section 4, backend chip package specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.1 64-pin tqfp package specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.2 100-pin tqfp package specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4.3 64-pin bga package specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.4 100-pin bga package specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
version 1.2, february 3, 2003 proprietary to omni vision technologies 3 o mni ision 00 list of figures figure 2-1. die shift tolerances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 2-2. die tilt tolerances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 figure 2-3. die rotation tolerances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 3-1. 24-pin clcc ceramic package specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 figure 3-2. 28-pin clcc ceramic package specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 3-3. 28-pin plcc plastic package specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 3-4. 48-pin clcc ceramic package specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 figure 3-5. 48-pin plcc plastic package specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 4-1. 64-pin tqfp package specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 4-2. 100-pin tqfp package specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 4-3. 64-pin bga package specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 4-4. 100-pin bga package specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4 proprietary to omni vision technologies version 1.2, february 3, 2003 omnivision packaging specifications o mni ision 00 list of tables table 3-1 24-pin clcc ceramic package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 3-2 28-pin clcc ceramic package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 3-3 28-pin plcc plastic package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 3-4 48-pin clcc ceramic package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 3-5 48-pin plcc plastic package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
general description version 1.2, february 3, 2003 proprietary to omni vision technologies 5 o mni ision 1 general description this document defines and describes the package specifications and dimensions for omnivision technologies c amera c hips tm . 2 die position 2.1 die shift specification figure 2-1. illustrates the camerach ip die shift tolerances which are as follows: ? x-axis: + 0.15 mm (6.0 mils) maximum ? y-axis: + 0.15 mm (6.0 mils) maximum figure 2-1. die shift tolerances die (at package center) cavity package substrate dam area boundary of maximum die shift allowed 0.15 mm y-axis 0.15 mm x-axis
6 proprietary to omni vision technologies version 1.2, february 3, 2003 omnivision packaging specifications o mni ision 2.2 die tilt specification figure 2-2. illustrates the omnivision c amera c hip die tilt tolerances. the tilt angle ( ) must be less than 1 degree. figure 2-2. die tilt tolerances ab e f cd f c d tan = c - d f tan < 0.017 < 1 degree tan = a - b e tan < 0.017 < 1 degree e a b
die position version 1.2, february 3, 2003 proprietary to omni vision technologies 7 o mni ision 2.3 die rotation specification figure 2-3. illustrates the omnivision c amera c hip die rotation tolerances. the rotation angle ( ) must be less than 3 degrees. figure 2-3. die rotation tolerances ab dam chip c tan = a - b c tan < 0.035 < 3 degrees
8 proprietary to omni vision technologies version 1.2, february 3, 2003 omnivision packaging specifications o mni ision 3 camerachip package specification 3.1 24-pin clcc ceramic package specification figure 3-1. 24-pin clcc ceramic package specifications + table 3-1. 24-pin clcc ceramic package dimensions dimensions millimeters (mm) inches (in.) package size 10.16 + 0.25 / -0.13 sq .400 +.01 / -.005 sq package height 2.24 + 0.28 .088 + .011 substrate height 0.51 + 0.05 .020 + .002 cavity size 6.99 + 0.15 sq .275 + .006 sq castellation height 1.14 + 0.13 .045 + .005 pin #1 pad size 0.51 x 2.16 .020 x .085 pad size 0.51 x 1.02 .020 x .04 pad pitch 1.27 + 0.10 .050 + .004 package edge to first lead center 1.91 + 0.25 .075 + .01 end-to-end pad center-center 6.35 + 0.13 .250 + .005 glass size 9.50 + 0.10 sq .374 + .004 sq glass height 0.55 + 0.05 .022 + .002 22 24 1 3 .050 typ .020 typ .250 typ 21 16 10 15 .009 r ref typ .012 r ref typ .040 ref typ 4 9 .270 .320 .008 .006 4 9 15 10 .012 typ .022 typ 718 6 1 24 19 3 1 24 22 .270 .006 .400 sq + .010 - .005 21 16 .020 .002 .030 .003 .015 .002 .065 .007 .005 ref typ .050 ref typ (metallized) ceramic kyocera a440 (black) mp-3 mp-1 mp-2 .006 r typ .006 r typ .005 x 45 o pin 1 index .085 ref .075 .010
camerachip package specification version 1.2, february 3, 2003 proprietary to omni vision technologies 9 o mni ision 3.2 28-pin clcc ceramic package specification figure 3-2. 28-pin clcc ceramic package specifications table 3-2. 28-pin clcc ceramic package dimensions dimensions millimeters (mm) inches (in.) package size 11.43 + 0.20 sq .450 + .008 sq package height 2.11 + 0.25 .083 + .01 substrate height 0.51 + 0.05 .020 + .002 cavity size 7.62 + 0.13 sq .300 + .005 sq castellation height 1.02 + 0.1 .040 + .004 pin #1 pad size 0.64 x 2.16 .025 x .085 pad size 0.64 x 1.27 .025 x .050 pad pitch 1.27 + 0.10 .050 + .004 package edge to first lead center 1.91 + 0.25 .075 + .010 end-to-end pad center-center 7.62 + 0.13 .300 + .005 glass size 10.41 + 0.10 sq .409 + .004 sq glass height 0.55 + 0.05 .022 + .002 5 7 11 12 20 20 9 6 8 chamfer pin 1 index 1 1 28 26 22 23 28 4 25 .040 typ 19 .007 max b/f pull back mp-2 mp-3 ceramic kyocera a440 (black) mp-4 .450 sq .008 .350 sq .006 .011 min .013 min b/f exposure .300 sq .005 .012 r typ. .012 r typ. 21 .200 .005 .110 ref typ .020 .002 .040 ref (metallized) .060 .006 .020 .002 .083 .01 .022 .004 .001 to .005 typ 11 .050 .004 18 12 19 25 .035 min. .025 .003 pin no. 1 index .008 r ref typ 26 28 1 4 5 .075 .010 .020 .002 .409 .004 .300 .005 .050 typ .085 typ .009 r ref typ .015 min typ o .014 typ .020 typ .010 x 45
10 proprietary to omni vision technologies version 1.2, february 3, 2003 omnivision packaging specifications o mni ision 3.3 28-pin plcc plastic package specification figure 3-3. 28-pin plcc plastic package specifications table 3-3. 28-pin plcc plastic package dimensions dimensions millimeters (mm) inches (in.) package size 11.43 + 0.10 sq .450 + .004 sq package height 2.35 + 0.1 .093 + .004 substrate height 0.70 + 0.05 .028 + .002 cavity size 7.00 + 0.10 sq .275 + .004 sq castellation height 1.07 + 0.05 .042 + .002 pin #1 pad size 0.64 x 2.16 .025 x .085 pad size 0.64 x 1.27 .025 x .050 pad pitch 1.27 + 0.10 .050 + .004 package edge to first lead center 1.90 + 0.10 .075 + .004 end-to-end pad center-center 7.62 + 0.10 .300 + .004 glass size 10.30 + 0.10 sq .406 + .004 sq glass height 0.55 + 0.05 .022 + .002 .042 .002 .028 .002 11 .050 .004 18 12 19 25 .035 min. .025 .003 typ 26 28 1 4 5 .075 .004 .093 .004 .022 .002 .001 to .005 typ pin 1 index .300 .004 .050 typ .085 typ .009 r ref typ .406 .004 .028 .002 (metallized) 5 7 11 8 96 20 o chamfer pin 1 index 1 1 28 26 23 22 21 28 4 18 12 25 19 .275 sq .004 .350 sq .006 .450 sq .004 .012 x 45 o .010 x 45
camerachip package specification version 1.2, february 3, 2003 proprietary to omni vision technologies 11 o mni ision 3.4 48-pin clcc ceramic package specification figure 3-4. 48-pin clcc ceramic package specifications table 3-4. 48-pin clcc ceramic package dimensions dimensions millimeters (mm) inches (in.) package size 14.22 + 0.30 / -0.13 sq .560 + .012 / - .005 sq package height 2.23 + 0.28 .088 + .011 substrate height 0.51 + 0.05 .020 + .002 cavity size 8.89 + 0.13 sq .350 + .005 sq castellation height 1.14 + 0.13 .045 + .005 pin #1 pad size 0.51 x 2.16 .020 x .085 pad size 0.51 x 1.02 .020 x .040 pad pitch 1.02 + 0.08 .040 + .003 package edge to first lead center 1.524 + 0.25 / -0.13 .06 + .010 / - .005 end-to-end pad center-center 11.18 + 0.13 .440 + .005 glass size 12.40 + 0.10 sq / 13.00 + 0.10 sq .488 + .004 sq / .512 + .004 sq glass height 0.55 + 0.05 .022 + .002 .022 .004 .001 to .005 typ .030 .002 .065 .007 .088 .011 .020 .002 .015 .002 .06 + .010 / - .005 .085 typ r .0075 (48 plcs) r .0075 (4 corners) .040 typ .040 .003 31 1 19 30 31 42 .350 sq .005 .430 sq .005 30 42 .032 min 43 43 19 18 18 48 48 1 6 6 7 7 31 42 30 19 .440 .005 43 48 1 6 7 18 .560 sq + .012 / - .005 pin 1 index .020 typ .488 .012 typ ref .004
12 proprietary to omni vision technologies version 1.2, february 3, 2003 omnivision packaging specifications o mni ision 3.5 48-pin plcc plastic package specification figure 3-5. 48-pin plcc plastic package specifications table 3-5. 48-pin plcc plastic package dimensions dimensions millimeters (mm) inches (in.) package size 14.22 + 0.10 sq .560 + .004 sq package height 2.30 + 0.10 .091 + .004 substrate height 0.70 + 0.05 .028 + .002 cavity size 8.60 + 0.10 sq .340 + .004 sq castellation height 1.02 + 0.05 .040 + .002 pin #1 pad size 0.51 x 2.00 .020 x .079 pad size 0.51 x 1.11 .020 x .044 pad pitch 1.02 + 0.10 .040 + .004 package edge to first lead center 1.50 + 0.10 .060 + .004 end-to-end pad center-center 11.22 + 0.10 .442 + .004 glass size 13.00 + 0.10 sq .512 + .004 sq glass height 0.55 + 0.05 .022 + .002 .060 .004 .079 typ r .0075 (48 plcs) r .0075 (4 corners) .044 typ .040 .004 .028 .002 .068 .004 .040 .002 .022 .002 .001 to .005 typ .091 .004 31 1 19 30 31 42 .560 sq .004 .340 sq .004 .442 sq .004 30 42 .036 min 43 43 19 18 18 48 48 1 6 6 7 7 .512 .004 31 42 30 19 .442 .004 43 48 1 6 7 18 .020 typ
backend chip package specifications version 1.2, february 3, 2003 proprietary to omni vision technologies 13 o mni ision 4 backend chip packa ge specifications 4.1 64-pin tqfp package specification figure 4-1. 64-pin tqfp package specifications 116 17 32 33 48 49 64 0.5 0.22 + 0.05 10.00 12.00 12.00 10.00 0.60 + 0.15 1.00 0.05 ~ 0.15 note: all dimensions are in mm 0 ~ 7 o 1.20 max 1.00 + 0.05 0.60 + 0.15
14 proprietary to omni vision technologies version 1.2, february 3, 2003 omnivision packaging specifications o mni ision 4.2 100-pin tqfp pa ckage specification figure 4-2. 100-pin tqfp package specifications note: all dimensions are in mm 125 26 50 51 75 76 100 0.5 0.22 + 0.05 14.00 16.00 0.08 0.60 + 0.15 1.00 0 ~ 7 o 1.20 max 1.00 + 0.05 0.60 + 0.15 16.00 14.00
backend chip package specifications version 1.2, february 3, 2003 proprietary to omni vision technologies 15 o mni ision 4.3 64-pin bga package specification figure 4-3. 64-pin bga package specifications 1 2 3 4 5 6 7 8 a b c d e f g h 0.10 top view detail b detail b bottom view detail a side view indicates ball a1 note: all dimensions are in mm 8.00 + 0.20 8.00 + 0.20 8.00 + 0.20 8.00 + 0.20 0.50 + 0.05 1.20 + 0.10 1.20 + 0.20 0.50 + 0.05 seating plane 0.12 max 0.70 + 0.05 1.25 + 0.15 0.25 + 0.05 0.30 + 0.05 detail a 5.60 bcs 5.60 bcs 0.80 bcs
16 proprietary to omni vision technologies version 1.2, february 3, 2003 omnivision packaging specifications o mni ision 4.4 100-pin bga pac kage specification figure 4-4. 100-pin bga package specifications note: all dimensions are in mm 1 2 3 4 5 6 7 8 a b c d e f g h 0.10 top view detail b bottom view detail a side view 9 10 i j indicates ball a1 9.00 + 0.20 9.00 + 0.20 9.00 + 0.20 9.00 + 0.20 detail a 7.20 bcs 0.80 bcs 7.20 bcs detail b 0.90 + 0.10 0.90 + 0.20 0.50 + 0.05 seating plane 0.10 max 0.70 + 0.05 1.25 + 0.15 0.25 + 0.05 0.30 + 0.05 0.50 + 0.05

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